Diamond Composite Materials: The Ultimate Solution for High-Performance Thermal Management

Revolutionizing Heat Dissipation with Diamond-Metal Composites

By integrating synthetic diamond particles into high-thermal-conductivity metal matrices (Ag, Cu, Al) through advanced composite manufacturing, diamond/metal composites achieve an unprecedented combination of ultra-high thermal conductivity and low thermal expansion, making them the next-generation material for high-power electronic packaging and thermal management.

Diamond-Copper (D/Cu) Composite: The Thermal Performance Benchmark

Material Structure
Diamond-Copper Composite (D/Cu) is a matrix composite of synthetic diamond powder and copper alloy. Utilizing premium lab-grown diamonds with intrinsic thermal conductivity of 1,000 W/m·K and near-zero thermal expansion, this material achieves perfect interfacial metallurgical bonding under optimized processing, delivering exceptional thermal and mechanical properties.

Key Advantages

• Unmatched Thermal Performance: Thermal Conductivity: 500–800 W/m·K (adjustable based on diamond-to-copper ratio); Low CTE: 4–8 ppm/°C, precisely matching semiconductor materials (e.g., Si, GaN, SiC) to minimize thermal stress.

• Design Flexibility: Adjustable diamond content (40%–70%) to balance thermal conductivity and CTE for specific applications.

• Surface Engineering: Compatible with Ni/Au plating for hermetic sealing, oxidation resistance, and solderability.

• Weight Reduction: Density 5.2–6.0 g/cm³, 30% lighter than traditional tungsten-copper (W/Cu) heat sinks.

Diamond-Aluminum (D/Al) Composite: Lightweight Alternative

Material Profile
Similar to D/Cu but with aluminum as the matrix, the Diamond-Aluminum Composite (D/Al) offers even greater weight savings while maintaining competitive thermal performance:

• Thermal Conductivity: 400–600 W/m·K

• CTE: 6–10 ppm/°C

• Density: 3.0–3.5 g/cm³, 40% lighter than D/Cu, ideal for aerospace and portable electronics.

Why Choose D/Al?
Optimized for applications where lightweight design is critical without compromising thermal management efficiency.

Dia/Cu vs. Dia/Al: Tailoring Solutions to Your Needs

Applications: Where Diamond Composites Excel

• Power Electronics: IGBT modules, motor controllers, and SiC/GaN device packaging

• Aerospace & Defense: Radar systems, avionics cooling, hypersonic vehicle thermal shields

• Optoelectronics: Laser diodes, LED arrays, fiber-optic transceivers

• Consumer Tech: High-performance CPUs, gaming GPUs, and ultra-thin laptop heat spreaders

Technical Superiority

• Precision Interface Bonding: Advanced vacuum hot-pressing ensures robust diamond-metal interfaces for minimal thermal resistance.

• Customizable Formulation: Fine-tune diamond size (50–200 μm), volume fraction, and matrix alloys (Cu, Al, Ag) for mission-specific requirements.

• Reliability: Stable performance under extreme conditions (–200°C to +500°C), withstanding thermal cycling and mechanical shock.

Why Partner with FOTMA?

• Performance Beyond Limits: Highest thermal conductivity among commercial composites.

• Weight-Saving Innovation: Replace conventional W/Cu or Mo/Cu with 30–50% lighter solutions.

• End-to-End Expertise: From diamond composite material design to prototyping and large-scale production.

• Quality Assurance: ISO 9001-certified manufacturing with consistent quality control and traceability.

• Proven Industry Experience: Our materials are applied in aerospace, EV, and semiconductor sectors worldwide, delivering trusted performance and reliability.

Visual & Conversion Enhancement

FOTMA’s Diamond Composite Materials exhibit a fine metallic luster with precision-polished surfaces, enabling seamless integration into high-end electronic assemblies. Each component is engineered to exact specifications for optimal heat dissipation and dimensional stability.

🔧 Custom Engineering: Our specialists collaborate with your design team to optimize thermal management materials for your device’s thermal and mechanical requirements.
📩 Contact us today for detailed datasheets, prototypes, and expert consultation on the best diamond composite solution for your application.